Kinyosha Co., Ltd. has maximized its long-accumulated technology in rubber compounding and filler dispersion to develop a non-silicone-based material.
■Non-silicone material
There are no concerns about electrical contact failures or glass fogging caused by siloxane.
■No curing process required
Since the curing reaction is already complete, it can be immediately passed to the next process after implementation, allowing for a reduction in man-hours.
■Surface conformability
With excellent flexibility, it conforms to deep irregularities and complex shapes, filling gaps between the housing or heat sink and the heat source, thereby improving heat dissipation performance.
■Reduced reaction force
There is significant stress relief after implementation and assembly, greatly reducing stress on the housing and circuit board components.
■Low bleed
It significantly reduces oil bleed, thereby lowering the risk of contamination.